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Lead RPA Developer at Bond Street Mortgage, LLC $76,190 | H1B Salary Data
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H1B Record: I-200-20157-631754
Case Number
I-200-20157-631754
Case Status
Certified
Visa Class
H-1B
Employer
Bond Street Mortgage, LLC
Job Title
Lead RPA Developer
SOC Code
15-1132.00
· Software Developers, Applications
Base Salary
$76,190
Range: $76,190 – $90,000
Prevailing Wage
$76,190
· I
Full Time
Yes
Location
Paramus, NJ
Year
2020
Submitted Date
2020-06-05
Start Date
2020-10-01
End Date
2023-09-30