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Director, Packaging Engineering at Western Digital Technologies, Inc $200,000 | H1B Salary Data
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H1B Record: I-200-20062-365878
Case Number
I-200-20062-365878
Case Status
Certified
Visa Class
H-1B
Employer
Western Digital Technologies, Inc
Job Title
Director, Packaging Engineering
SOC Code
17-2131.00
· Materials Engineers
Base Salary
$200,000
Range: $200,000 – $220,000
Prevailing Wage
$139,318
· IV
Full Time
Yes
Location
Milpitas, CA
Year
2020
Submitted Date
2020-02-28
Start Date
2020-08-21
End Date
2023-08-20