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Packaging Engineer at Texas Instruments Incorporated $139,000 | H1B Salary Data

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H1B Record: I-200-19326-163764

Case Number

I-200-19326-163764

Case Status

Certified

Visa Class

H-1B

Employer

Texas Instruments Incorporated

Job Title

Packaging Engineer

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$139,000

Prevailing Wage

$99,133 · III

Full Time

Yes

Location

Year

2019

Submitted Date

2019-11-22

Start Date

2019-12-06

End Date

2022-12-05